DEBOND proposes to develop new materials and processes to improve the debonding performance of flexible packaging and textiles applications. The project will combine the skills of the partners along the full product line and the ones of the targeted SMEs and multinationals.
The developments will focus on two market sectors facing similar challenges: flexible packaging and textiles.
DoD means the intentional separation (or reduction of adhesion) of an adhesive joint or separation of a coating from a substrate.
The debonding process is initiated by a so-called trigger, e.g. a heat or a light pulse. Ideally the trigger mechanism is not initiated in the period when the product is in use.
Today only a very limited set of commercial solutions exist for DoD. Most approaches in science and in industry focus on the modification of the adhesive, by the incorporation of smart particles or by a chemical modification of the adhesive polymer network.
FOR EXAMPLE: BY APPLYING A HEAT TRIGGER PULSE, THE EMBEDDED PARTICLES EXPAND OR THE POLYMER BACKBONE DISSOCIATES AFTER BEING TRIGGERED BY A UV LIGHT PULSE.
Both mechanisms provoke a weakening of the adhesive resulting in a full and clean separation.
Partners
Aknowledgements
Cornet project, financed by VLAIO (Flanders) and AIF (Germany).
